(Nanowerk Spotlight) The field of drug delivery has long been challenged by the need for precise, targeted methods to transport therapeutic agents within the body. Traditional approaches often ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

Korean researchers have developed a new analysis method capable of detecting “hidden defects” in semiconductors with a ...

This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).

Semiconductors are used in devices such as memory chips and solar cells, and within them may exist invisible defects that ...

Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs.

An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...

CNC machining benefits, precision engineering, advanced fabrication techniques, tight tolerance manufacturing, custom ...