Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

In my two previous columns, I discussed the lower and intermediate levels of the building block approach for crashworthiness testing and analysis of composite structures. I focused on the commercial ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, ...

They can image a wide range of materials and biological samples with high magnification, resolution, and depth of field, thereby revealing surface structure and chemical composition. Industries like ...

Analyzing failures in printed circuit boards (PCBs) is critical to ensure the functionality and reliability of electronic devices. A synopsis of the methods and techniques utilized in PCB failure ...

These developments continue to fuel growing investment into the technology and manufacture of semiconductor devices at both industrial and academic research levels. Improvements in technology, ...